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US Patent Issued to KYOCERA AVX Components on Sept. 22 for "Package-on-package assembly containing a decoupling capacitor" (California Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,679, issued on Sept. 22, was assigned to KYOCERA AVX Components Corp. (Fountain Inn, S.C.). "Package-on-package assembly containing a deco... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor package with reduced adhesive fillets" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,680, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package with reduced adhe... और पढ़ें


US Patent Issued to Apple on Sept. 22 for "Chip singulation assisted structures and methods for improving bonding interface quality" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,681, issued on Sept. 22, was assigned to Apple Inc. (Cupertino, Calif.). "Chip singulation assisted structures and methods for improving b... और पढ़ें


US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Sept. 22 for "Multi-chip high memory bandwidth configuration" (New York Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,683, issued on Sept. 22, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Multi-chip high memory bandwidth configura... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,684, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufa... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,685, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufa... और पढ़ें


US Patent Issued to University of Washington on Sept. 22 for "Treatment planning and aberration correction algorithms for high intensity focused ultrasound (HIFU) ablation of soft tissue targets" (Washington Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,740,763, issued on Sept. 22, was assigned to University of Washington (Seattle). "Treatment planning and aberration correction algorithms for ... और पढ़ें


US Patent Issued to Konica Minolta on Sept. 22 for "Ultrasound diagnostic apparatus, ultrasound diagnostic method, and recording medium" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,740,764, issued on Sept. 22, was assigned to Konica Minolta Inc. (Tokyo). "Ultrasound diagnostic apparatus, ultrasound diagnostic method, and ... और पढ़ें


US Patent Issued to SAMSUNG MEDISON on Sept. 22 for "Ultrasound remote diagnosis system and method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,740,765, issued on Sept. 22, was assigned to SAMSUNG MEDISON Co. LTD. (Gangwon-Do, South Korea). "Ultrasound remote diagnosis system and metho... और पढ़ें


US Patent Issued to NIKE on Sept. 22 for "Processing and analyzing ultrasound shear wave elastography images" (Oregon Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,740,766, issued on Sept. 22, was assigned to NIKE Inc. (Beaverton, Ore.). "Processing and analyzing ultrasound shear wave elastography images"... और पढ़ें